Project Objective

Validate and characterize the Audio ADC/DAC across PVT on our UFLEX ATE. Focus: Class-H boost efficiency, ultra-low noise, I/V sensing for speaker protection, and verification of protection features (OCP, OTP, OVP, UVLO, battery/boost limits).

Device Overview

Mono Class-D smart amplifier with integrated Class-H boost that raises headroom to improve efficiency and deliver required power for small mobile speakers. Includes high dynamic range ADC path for I/V sensing, dedicated V-sense pin, temperature sensors and MIPI SoundWire telemetry.

  • Class-H boost up to ~11.5 V for envelope tracking and efficiency
  • Typical output: ~5 W @ 8 Ω (variants up to ~7.3 W)
  • Low receive noise (~6.8 μVrms) and high SNR (~118 dB)
  • Integrated I/V ADC path for speaker protection
  • MIPI SoundWire for telemetry and audio/control streaming

ATE Platform & Hardware Setup

Test execution on Teradyne UFLEX with 32 synchronous sites. Hardware: wafer-sort probe cards for production, multi-layer package load boards, and daughter cards for high-fidelity characterization. Qualification in thermal chambers from –40°C to +125°C; production at 25°C.

  • UFLEX controller with SMUs, AWGs, DMMs and audio analyzer interfaces
  • 32-site probe card and modular package-level load boards
  • Daughter card for bench correlation and wideband analog capture
  • Per-site telemetry and closed-loop thermal control

Test Categories

A. DC and Power Validation

Measure IDDQ, leakage, regulator outputs, bandgap and temperature sensor validation across PVT. Verify UVLO and battery/boost limits.

B. Functional and Timing Verification

Validate audio ADC/DAC across sample rates (8 kHz – 384 kHz), driver modes (Class-D, Class-AB), and digital audio interfaces (PDM, SoundWire, I²S, SLIMbus).

C. Dynamic and Performance Measurement

THD+N and gain via audio analyzer, frequency response sweeps (20 Hz – 20 kHz), IRN/ORN and PSRR measurements using onboard circuits.

D. Digital Interface & NVM Programming

Scan tests, I²C/SoundWire read & write checks, NVM programming/verify and telemetry streaming verification.

E. Trim & Calibration

Temperature & battery-monitor calibration, I/V sense calibration, and OTP trimming workflows for production and qualification.